CSP-43

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CSP-43

The CSP-43 (Chip Scale Package) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 43-lead configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.

Part Number Description Manufacturers Inventory Add To Bom
EFR32BG1P332F256GJ43-C0 High-performance wireless connectivity enable Silicon Labs 7,475
EFR32BG1P332F256GJ43-C0R Experience seamless connectivity with 2Mbps Bluetooth RF Transceiver IC Silicon Laboratories 2,889