CSP-43
(2)
The CSP-43 (Chip Scale Package) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 43-lead configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| EFR32BG1P332F256GJ43-C0 | High-performance wireless connectivity enable | Silicon Labs | 7,475 | |
| EFR32BG1P332F256GJ43-C0R | Experience seamless connectivity with 2Mbps Bluetooth RF Transceiver IC | Silicon Laboratories | 2,889 |