CSP-289

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CSP-289

The CSP-289 (Chip Scale Package) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 289-lead configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.

Part Number Description Manufacturers Inventory Add To Bom
AGLP125V2-CSG289I Rapid development with 130nm technology Microchip Technology 5,681
AGLP125V2-CS289I High-performance FPGA for advanced data processing and analytics applications Microchip Technology 2,867
AGLP060V5-CSG289I Versatile 60K gate count for complex system designs Microchip Technology 6,218