CBGA-48
(2)
The CBGA-48 (Ceramic Ball Grid Array Package) offers a robust, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for enhanced thermal performance and durability, this 48-ball configuration is well-suited for aerospace, defense, and medical applications requiring rugged and compact packaging.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| AT49BV162A-70CI | Parallel interface and fast access times make it suitable for data logging and storag | Microchip Technology | 7,112 | |
| AT49BV802D-70CU | Advanced / parallel flash memory solution for demanding electronics project | Microchip Technology | 2,515 |