CBGA-360
(5)
The CBGA-360 (Ceramic Ball Grid Array) offers a robust, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for optimal thermal performance and durability, this 360-ball configuration is ideal for demanding applications across aerospace, defense, and industrial sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| PC7447AMGH1000NB | Advanced processing unit | Microchip Technology | 8,789 | |
| MPC755CPX400LE | Advanced 0.22um technology | NXP | 7,604 | |
| MPC755CRX400LE | Explore the capabilities of the MPC755CRX400LE, incorporating advanced GF RV2 | Freescale Semiconductor | 7,429 | |
| MPC755BRX300LE | Product Description: Microprocessors - MPU 360CBGARV2.8HIP4DP (MPC755BRX300LE) | Freescale Semiconductor | 7,140 | |
| MPC755BVT300LE | Freescale series 300MHz Microcontroller Units (MCUs/MPUs/SOCs) with FCPBGA-360(25x25) dimensions | Freescale Semiconductor | 7,540 |