BGA144
(2)
The BGA144 (Ball Grid Array 144) provides a high-density, high-reliability packaging solution for integrated circuits in advanced electronic systems. This 144-ball configuration is designed for optimal thermal efficiency and space-saving footprint, making it ideal for a wide range of applications in the telecommunications, automotive, and consumer electronics industries.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| BLY587 | Original Chinese products seeking sample orders for further development | Asi | 2,163 | |
| AT32UC3A3256J-CTUR | 32-bit Microcontrollers - MCU product AT32UC3A3256J-CTUR | Microchip Technology | 7,404 |