BGA-Module
(3)
The BGA-Module (Ball Grid Array Module) provides a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for optimal thermal efficiency and a minimal footprint, this module is perfect for space-constrained applications in telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| OVM6211-RADA | High-quality BGA image sensors for reliable imaging application | OmniVision Technologies Inc | 7,238 | |
| OVM6211-RAHA | CAMERA CUBE CHIP WITH black coating | OmniVision Technologies Inc | 6,518 | |
| OV07676-H20A | Never used before and still in its original packaging | OmniVision Technologies Inc | 9,416 |