BGA-85
(4)
The BGA-85 (Ball Grid Array) provides a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 85-ball configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| R5F523W8ADBL#20 | Product R5F523W8ADBL#20: A versatile solution for IoT endpoint devices | Renesas Electronics Corporation | 6,329 | |
| R5F523W7BDBL#20 | Unleash the potential of connected devices with this -bit MCU | Renesas Electronics America Inc | 8,693 | |
| R5F523W8BDBL#20 | RXv2 Core 32-Bit Microcontroller with 512K-byte Flash and BGA Packaging | Renesas | 2,272 | |
| R5F523W7ADBL#20 | R5F523W7ADBL#20 | Renesas | 3,025 |