BGA-56
(4)
The BGA-56 (Ball Grid Array 56) provides a high-density and reliable packaging solution for integrated circuits in advanced electronic systems. With 56 solder balls for secure connections, this package is designed for optimal thermal performance and space efficiency in a wide range of applications, including telecommunications, automotive, and consumer electronics.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| LTM4642EY#PBF | BGA-56 ROHS Compliant | Analog Devices | 9,888 | |
| LTM4642IY#PBF | The LTM4642IY#PBF is a high-performance POL (Point of Load) product operating at a frequency of 1.4MHz | Analog Devices | 8,360 | |
| LTM4642IY | 20VIN, Dual 4A or Single 8A DC/DC μModule Regulator | Analog Devices | 5,350 | |
| IS29GL128-70GLEB | IS29GL128-70GLEB | Issi | 3,541 |