BGA-529

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BGA-529

The BGA-529 (Ball Grid Array Package) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 529-ball configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.

Part Number Description Manufacturers Inventory Add To Bom
MCIMX512DJM8C ARM Cortex-A8 core NXP 8,815
MCIMX535DVV1C NXP MCIMX535DVV1C MPU NXP Semiconductors 6,809
ADSP-SC589BBCZ-5B Dual SHARC processors combined with ARM core for advanced signal processing capabilities, with dual DDR and PCle support Analog Devices 9,753
MCIMX512DJM8CR2 State-of-the-art ARM Cortex Acore with robust power management and security features Nxp Semiconductors 6,166
MCIMX537CVV8CR2 i.MX53 32-bit MPU with ARM Cortex-A8 core running at 800MHz NXP Semiconductors 7,015
ADSP-SC587KBCZ-5B High-performance processing for demanding applicatio Analog Devices 8,341
ADSP-21587BBCZ-5B High-performance digital signal processor for demanding applications Analog Devices 7,728
ADSP-21587BBCZ-4B Advanced digital signal processing solution for complex tasks Analog Devices Inc. 7,194
ADSP-21587KBCZ-5B Digital Signal Processors & Controllers - DSP, DSC 2xSHARC(no ARM&reduced conn)dualDDR,HPCP Analog Devices 6,294
ADSP-SC587BBCZ-4B High-performance processing for demanding applicatio Analog Devices Inc. 9,604
ADSP-SC589BBCZ-4B DSP Floating-Point processor Analog Devices 7,661
MCIMX535DVV1CR2 MCIMX535DVV1CR2 Product Overview: Delve into the features of Microprocessors - MPU iMX53 Rev 2.1 Comm Freescale Semiconductor 7,110