PBGA-516
(8)
The BGA-516 (Ball Grid Array package with 516 balls) provides a high-density, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for optimal thermal performance and a small footprint, this 516-ball configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| STPCI2GDYI | SOC STPC Atlas X86 516-Pin PBGA Tray | Stmicroelectronics Nv | 6,425 | |
| STPCI2HEYCE | State-of-the-art processing capabilities | STMicroelectronics NV | 6,184 | |
| SPC5674FF3MVV3 | Suitable for Trays packaging | Freescale Semiconductor | 8,902 | |
| SPC5674FF3MVY3 | The SPC5674FF3MVY3 microcontroller is designed for advanced applications that require fast processing and ample memory storage | Freescale Semiconductor | 9,464 | |
| DLPC6421AZPC | High-performance driver for various applications | Texas Instruments | 6,256 | |
| SPC5673FAMVY2 | 32-bit Microcontrollers - MCU 3M FLASH, 256K RAM, z7, 200Mhz | Nxp | 5,416 | |
| SPC5777CLK3MMO3R | SPC5777CLK3MMO3R: 32-bit e200z7 RISC Microcontroller with 8MB Flash, Automotive Grade, 3 | NXP Semiconductors | 7,935 | |
| DLPC4420ZPC | Robust and Flexible Lighting Control with Enhanced Safety Feature | Texas Instruments | 8,033 |