BGA-388
(9)
The BGA-388 (Ball Grid Array 388) provides a high-density, reliable packaging solution for integrated circuits in advanced electronic systems. With 388 solder balls for secure connections, this package is designed for thermal efficiency and minimal footprint, making it ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
Part Number | Description | Manufacturers | Inventory | Add To Bom |
---|---|---|---|---|
MPC561MZP56 | Advanced Microcontroller with MPC561MZP56 | NXP Semiconductors | 8,844 | |
STPCE1HEBI | Plastic-packaged peripheral with ball grid array | stmicroelectronics | 6,293 | |
MPC564CVR40 | Microcontroller Solution for Automotive Applications | Nxp Semiconductors | 3,020 | |
MPC565MZP56R2 | High-performance microcontroller with ,K FLASH memory and advanced peripherals for embedded systems applications | Nxp | 6,323 | |
NS9750B-A1-I162 | High-performance network processor operating at 162MHz, with support for both 1.5V and 3.3V power supplies, featuring a 388-pin BGA design | digi international | 6,971 | |
MPC563MVR66 | High-performance microcontroller for industrial automation and control systems applications | NXP Semiconductors | 7,659 | |
NS9750B-A1-C200 | Single processor integrated circuit 32-bit 388-pin ball grid array | DIGI | 5,681 | |
MPC562MZP56 | 32-bit Microcontrollers - MCU MPC562 NOFLASH CODECMP | Freescale Semiconductor | 2,898 | |
MPC561CZP40 | Operates at both 2.6V and 5V voltage levels | Freescale Semiconductor | 9,624 |