BGA-388

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BGA-388

The BGA-388 (Ball Grid Array 388) provides a high-density, reliable packaging solution for integrated circuits in advanced electronic systems. With 388 solder balls for secure connections, this package is designed for thermal efficiency and minimal footprint, making it ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.

Part Number Description Manufacturers Inventory Add To Bom
MPC561MZP56 Advanced Microcontroller with MPC561MZP56 NXP Semiconductors 8,844
STPCE1HEBI Plastic-packaged peripheral with ball grid array stmicroelectronics 6,293
MPC564CVR40 Microcontroller Solution for Automotive Applications Nxp Semiconductors 3,020
MPC565MZP56R2 High-performance microcontroller with ,K FLASH memory and advanced peripherals for embedded systems applications Nxp 6,323
NS9750B-A1-I162 High-performance network processor operating at 162MHz, with support for both 1.5V and 3.3V power supplies, featuring a 388-pin BGA design digi international 6,971
MPC563MVR66 High-performance microcontroller for industrial automation and control systems applications NXP Semiconductors 7,659
NS9750B-A1-C200 Single processor integrated circuit 32-bit 388-pin ball grid array DIGI 5,681
MPC562MZP56 32-bit Microcontrollers - MCU MPC562 NOFLASH CODECMP Freescale Semiconductor 2,898
MPC561CZP40 Operates at both 2.6V and 5V voltage levels Freescale Semiconductor 9,624