BGA-381
(5)
The BGA-381 (Ball Grid Array Package) provides a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Engineered for thermal efficiency and reduced footprint, this 381-ball configuration is well-suited for space-constrained applications in telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| LAE5UM-25F-6BG381E | LAE5UM-25F-6BG381E is a 24000 logic element | Lattice | 6,179 | |
| LAE5UM-45F-7BG381E | High-performance microcontroller for industrial and automotive application | Lattice Semiconductor Corporation | 8,786 | |
| LAE5U-12F-7BG381E | Advanced programmable gate array for efficient designs | Lattice Semiconductor Corporation | 5,405 | |
| LAE5UM-45F-6BG381E | Ultra-low power consumption for extended battery life | Lattice Semiconductor Corporation | 7,264 | |
| LAE5U-12F-6BG381E | operating voltage supports reliable operation | Lattice Semiconductor Corporation | 7,580 |