inventory:7,978
Diodes Incorporated
SOIC-8
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The BGA-364 (Ball Grid Array) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 364-ball configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| MVF61NS152CMK50 | Operating at 500 MHz | Nxp Semiconductors | 5,308 | |
| SVF522R2K1CMK4 | Dual-core processor featuring ARM Cortex-Aand Cortex-Mcores, ideal for IoT devices | NXP Semiconductors | 9,254 | |
| MVF62NN152CMK40 | Microprocessors - MPU Vybrid F 32-bit MPU, ARM Cortex-A5 core, 400 MHz, ARM Cortex-M4 core, 266 MHz, MAPBGA 364 | Nxp | 6,819 | |
| SVF522R2K2CMK4 | Versatile MPU for automation, robotics, and medical devices | Nxp | 7,246 | |
| SVF522R3K1CMK4 | High-performance controller for diverse industries including IoT, AI and more | NXP Semiconductors | 5,369 | |
| SVF532R3K2CMK4 | Powerful -bit ARM Cortex-Acore for efficient processing of complex tasks | NXP USA Inc. | 9,192 | |
| MVF50NN152CMK40 | High-speed processing meets low power consumption in this versatile Arm-based MCU solution | NXP USA Inc. | 6,253 | |
| SVF532R2K1CMK4R | Next-generation processor with optimized architecture for enhanced performance, power efficiency, and reliability | NXP USA Inc. | 9,427 | |
| 88AP270M-BHE1 | Available in stock, the 88AP270M-BHE1 processor is a reliable electronic component | Marvell | 6,780 | |
| SVF532R2K1CMK4 | MPU VF3xxR RISC 32bit 40nm 133MHz/400MHz Automotive AEC-Q100 364-Pin MAP-BGA Tray | NXP USA Inc. | 9,125 | |
| SVF521R3K1CMK4 | MPU VF5xxR RISC 32bit 40nm 400MHz Automotive 364-Pin MAP-BGA Tray | NXP Semiconductors | 9,746 |