BGA-361

(2)
BGA-361

The BGA-361 (Ball Grid Array Package) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 361-ball configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.

Part Number Description Manufacturers Inventory Add To Bom
TMS320DM6446AZWT This DSP/DSC product is ideal for a wide range of applications, including audio and video processing, image recognition, and communication systems TI 7,413
AM1802EZCED3 Low-power, high-efficiency processing solution for IoT application TI 9,143