BGA-361
(2)
The BGA-361 (Ball Grid Array Package) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 361-ball configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
Part Number | Description | Manufacturers | Inventory | Add To Bom |
---|---|---|---|---|
TMS320DM6446AZWT | This DSP/DSC product is ideal for a wide range of applications, including audio and video processing, image recognition, and communication systems | TI | 7,413 | |
AM1802EZCED3 | Low-power, high-efficiency processing solution for IoT application | TI | 9,143 |