BGA-356

(12)
BGA-356

The BGA-356 (Ball Grid Array) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 356-ball configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.

Part Number Description Manufacturers Inventory Add To Bom
EPF10K50VBI356-3 FPGA FLEX 10K Family Intel 5,746
EL4544IGZ Compliant with RoHS Directives, Ideal for PCB Designs (46 characters) Renesas 5,392
EPF10K100EBC356-1N Field Programmable Gate Array EPF10K100EBC356-1N: Offering 624 LABs and 274 IOs, facilitating adaptable circuitry solutions Intel 4,898
EPF10K50SBC356-2 Field-Programmable Gate Array with 360 cells, featuring 356 pins, encased in a plastic Ball Grid Array (BGA) package Intel 3,394
EP20K100EBC356-2X Advanced programmable logic device for high-performance systems development Intel 3,642
EPF10K50VBC356-2 Unleash the power of reconfigurable logic with the EPFKVBCFPGA, boasting programmable LABs and I/O pins for enhanced flexibility Intel 5,793
EP20K160EBC356-1N A highly flexible and programmable digital logic device for a wide range of applications Intel 5,690
EP20K160EBC356-1X Advanced logic density and high-speed operation at Hz using um technolog Intel 2,197
ISL59530IKZ High-speed video processor for efficient data processin Renesas Electronics Corporation 5,185
EPF10K50VBC356-2N Advanced gate array for high-density, low-power application Intel 5,696
EPF10K50BC356-3 Unlock limitless possibilities with EPFKBCs Flex K architecture, featuring I/Os and LABs for seamless integration into your syste Intel 7,180
EPF10K130EBC356-3 A versatile and flexible programmable logic device ideal for embedded systems and high-speed digital design applications Altera 8,863