BGA-325
(6)
The BGA-325 (Ball Grid Array-325) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 325-ball configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| XC7A35T-1CSG325C | IC FPGA 150 I/O 324CSBGA | xilinx | 6,562 | |
| MPF100T-1FCSG325E | 284 I/O Lines for versatile connectivity | Microchip Technology | 5,350 | |
| MPF100TLS-FCSG325I | FPGA featuring 7.8Mb memory and 4 TransChips for data transfers ranging from 250Mbps to 12.7Gbps | Microchip Technology | 9,756 | |
| MPFS095TS-1FCSG325I | Integrated RISC-V CPU with 93KLEs of programmable logic | Microchip Technology | 9,111 | |
| MPFS095T-1FCSG325E | Compact and efficient MPFS-CSG SoC FPGA for rapid design implementatio | Microchip Technology | 7,696 | |
| MPF100T-1FCSG325I | FPGA Type: PolarFire Mid-Range FPGA | Microchip Technology | 6,970 |