BGA-265
(3)
The BGA-265 (Ball Grid Array 265) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 265-ball configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| MSCMMX6XYCM08AA | Rich feature set includes a channel -bit ADC, making it an ideal choice for precision analog-to-digital conversion task | Nxp Semiconductors | 2,140 | |
| NS9215B-0-I150 | Compact and reliable semiconductor device for modern electronics | DIGI | 7,484 | |
| MSCMMX6XYDM08AA | Advanced ARM Cortex ACortex Mprocessor for demanding task | Nxp Semiconductors | 3,266 |