BGA-260
(11)
The BGA-260 (Ball Grid Array) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 260-ball configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| VSC8224XHG | Ethernet PHY, 1000Mbps | Microchip Technology | 7,378 | |
| GS81313LD36GK-714I | State-of-the-art 36-bit SRAM for mission-critical operations | Gsi Technology | 3,103 | |
| GS81313LD18GK-714I | Enhance processing power with this high-capacity, low-voltage RAM | Gsi Technology | 6,105 | |
| GS81314LD19GK-933I | Ultra-reliable storage solution for data-intensive application | GSI Technology, Inc. | 5,813 | |
| ADSP-BF516BBCZ-4 | DSP Fixed-Point 16bit/32bit 400MHz 168-Pin CSP-BGA Tray | Analog Devices Inc. | 6,301 | |
| GS81314LQ19GK-933I | Get the high-performance BGA-260 SRAM for the latest tech projects | Gsi Technology | 6,992 | |
| GS81314LQ37GK-933I | BGA-260(14x22) SRAM ROHS | Gsi Technology | 5,010 | |
| GS82583ET36GK-625I | High-performance SRAM module for efficient data storage | Gsi Technology | 6,410 | |
| GS8673ED36BGK-675 | Cutting-edge 2M x 36 configuration for fast processing | Gsi Technology | 6,181 | |
| GS8673ED36BGK-625S | Reliable memory solution for demanding applications | Gsi Technology | 2,757 | |
| ADSP-BF535PBBZ-200 | 260-Pin BGA Tray | Analog Devices | 4,583 |