BGA-184
(3)
The BGA-184 (Ball Grid Array-184) provides a high-density, reliable packaging solution for integrated circuits in advanced electronic systems. With 184 solder balls for secure connections, this package is designed for thermal efficiency and space-saving applications in telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| ADSP-BF707BBCZ-4 | Versatile DSP solution offering both 16-bit and 32-bit processing at a rapid 400MHz, housed in a convenient tray format." | Analog Devices | 8,303 | |
| ADSP-BF707KBCZ-4 | Advanced DSP technology with 16-bit and 32-bit capabilities | Analog Devices | 6,029 | |
| ADSP-BF707BBCZ-3 | DSP 16bit/32bit 300MHz 184-Pin CSP-BGA Tray | Analog Devices Inc. | 8,707 |