BGA-149
(4)
The BGA-149 (Ball Grid Array 149) provides a high-density, high-reliability packaging solution for integrated circuits in advanced electronic systems. With 149 solder balls for secure connections, this package is designed for thermal efficiency and minimal footprint, making it ideal for space-constrained applications in telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| S6AA8803IA13 | Industrial-grade NAND flash memory solution for demanding application | Skyhigh Memory | 7,774 | |
| S6AA4411IA10 | Industrial Grade 149 Ball BGA MCP with Tray Packing: 4Gb NAND Flash and 4Gb DRAM | Skyhigh Memory | 4,672 | |
| S6AA4411IA13 | Compact and efficient solution for storage needs | Skyhigh Memory | 7,546 | |
| S6AA8803BA13 | Superior 149-ball BGA packaging for reliability | Skyhigh Memory | 5,074 |