BGA-113
(4)
The BGA-113 (Ball Grid Array-113) provides a high-density and reliable packaging solution for integrated circuits in advanced electronic systems. With 113 solder balls for secure connections, this package is designed for optimal thermal performance and space efficiency. Ideal for various applications in telecommunications, automotive, and consumer electronics industries.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| MSP430FG4616IZQWT | MSPG combines high-speed processing with low power consumption for extended battery life | Texas Instruments | 5,824 | |
| MSP430BT5190IZQWT | 113-Pin BGA MICROSTAR JUNIOR package | texas instruments | 7,959 | |
| LTM8027IY | 0V, 4A Power Module Regulator | Analog Devices | 5,579 | |
| LTM8027MPY | BGA-113 DC-DC Converters ROHS | Analog Devices | 4,307 |