108-Lead BGA

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108-Lead BGA

The BGA-108 (Ball Grid Array 108) provides a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Engineered for thermal efficiency and space optimization, this 108-ball configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.

Part Number Description Manufacturers Inventory Add To Bom
LTM8064EY#PBF 58V Input, 6A Constant Voltage Constant Current Step-Down Module Regulator Analog Devices 5,991
LTM4675EY#PBF Digital Power System Management for LTM4675EY#PBF Analog Devices 5,476
LTM4675IY#PBF DC-DC converter Analog Devices 8,308
LTM8064IY#PBF 58VIN, 6A CVCC Step-Down μModule Regulator Analog Devices 8,974
LTM8064IY 58VIN, 6A CVCC Step-Down μModule Regulator Analog Devices 6,575
ADUC7122BBCZ -bit/-bit ARMDMI RISC processor-based MCU for high-reliability applications with power supply Analog Devices 8,115
ADUC7121BBCZ-RL This versatile ARM7TDMI-based device integrates 12-bit ADC/DAC functionality with advanced MCU features for precise signal processing Analog Devices 9,634
ADUC7120BBCZ MCU 16-bit/32-bit ARM7TDMI RISC 126KB Flash 3.3V 108-Pin CSP-BGA Tray Analog Devices Inc. 7,766
AD5379ABCZ DAC 40-CH Resistor-String 14-bit 108-Pin CSP-BGA Tray Analog Devices 4,313
AD5379ABC 14-Bit DAC IC with 40 Channels for Digital to Analog Conversion Analog Devices Inc. 5,608