BGA-783
(13)
The 783-BFBGA (Ball Grid Array) is a high-density packaging solution for integrated circuits in advanced electronic systems. With 783 solder balls for secure connections, this packaging is designed for optimal thermal performance and reliability in space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| MPC8560VT833LB | High-performance microprocessor | Freescale Semiconductor | 5,016 | |
| MPC8560VT833LC | 783-Pin FCBGA Tray | NXP Semiconductors | 8,373 | |
| MPC8540VT833LB | 783-FCPBGA (29x29) | NXP USA Inc. | 6,381 | |
| MPC8540CVT667JC | Advanced technology integration for efficiency | NXP Semiconductors | 6,059 | |
| KMPC8560VTAQFB | Speedy 1000MHz clock speed for quick data processing | Nxp Usa Inc. | 4,922 | |
| KMPC8540PXAQFB | MPC85xx IC with 1 core and 1.0GHz speed for efficient processing | Nxp Usa Inc. | 3,570 | |
| KMPC8560PX667LB | Compact 783-FCPBGA package measuring 29x29mm | Nxp Usa Inc. | 6,586 | |
| KMPC8540VT667LC | Ideal for complex systems requiring low power consumption and high performanc | Nxp Usa Inc. | 7,163 | |
| KMPC8560PX833LC | 783-FCPBGA package for compact yet efficient design | Nxp Usa Inc. | 5,051 | |
| MPC8540PX667LB | Fast and efficient microprocessor for embedded system | Nxp Usa Inc. | 6,294 | |
| KMPC8560CVT667JB | -bit, single-core PowerPC emicroprocessor running at Hz frequency and packaged in a xmm FC-PBGA (pin) packag | Nxp Usa Inc. | 6,644 | |
| KMPC8540PX667LC | -bit architecture supports complex instruction | Nxp Usa Inc. | 2,024 | |
| KMPC8560PX667LC | Single-core, -bit processor running at Hz spe | Nxp Usa Inc. | 3,993 |