BGA-52

(13)
BGA-52

The 52-VFBGA (Very Thin Fine-pitch Ball Grid Array) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 52-ball configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.

Part Number Description Manufacturers Inventory Add To Bom
CDCU877BZQLR Optimize data transfer rates by using this clock buffer/driver IC for DDRmemories Texas Instruments 6,981
S71VS064RB0AHTCL0 Compact and cost-effective packaging option for high-density applications Infineon Technologies 6,412
CDCU877AZQLT This buffer's 52-pin BGA package provides a compact and reliable solution for digital design engineers Texas Instruments 6,526
CDCU877AZQLR High-performance differential buffer for precise signal transmission Texas Instruments 8,756
98ULPA877AHLF <p>Ultra-low power consumption and high-speed performance.</ Renesas Electronics Corporation 8,891
98ULPA877AHLFT Advanced timing solution for mission-critical system Renesas Electronics Corporation 9,337
ICS97U877AHLFT Fast and reliable PLL IC for clock signal generatio Renesas Electronics Corporation 2,711
ICS97ULP877BHLF Low-power, high-frequency buffer/driver for enhanced system reliabilit Renesas Electronics Corporation 3,777
IDTCSPUA877ABVG High-speed data transfer enabled by this clock buffer driver Renesas Electronics Corporation 7,218
97U877AHLFT <p>No longer supported by manufacturer</ Renesas 3,166
CDCUA877ZQLR High-performance clocking solution with zero delay buffe Texas Instruments 8,592
CDCUA877ZQLT Fast and efficient clock signaling soluti Texas Instruments 9,920
CDCU877ZQLT High-performance differential buffer enables low-latency signal transmission in embedded systems Texas Instruments 6,286