BGA-1022
(6)
The 1022-BGA (Ball Grid Array) features a high-density interconnection design encapsulated in a reliable packaging solution for integrated circuits in advanced electronic systems. With a multitude of solder balls for secure connections, this package offers excellent thermal efficiency and a small footprint, making it ideal for space-constrained applications in telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| R8A774B0HA01BG#U0 | Processors - Application Specialized SOC RZ/G2N HDMI OFF | Renesas Electronics | 7,731 | |
| R8A774A0HA01BG#U2 | Microprocessors - MPU RZ/G2M SOC HDMI-OFF 384K RAM PFBGA | Renesas Electronics | 6,184 | |
| R8A774A0HA01BG#G2 | This cutting-edge RZ/G Microprocessor supports advanced graphics and computing tasks with remarkable speed and accuracy | Renesas Electronics Corporation | 8,323 | |
| R8A774E0HA01BN#G0 | 64bit FCBGA-1022 microprocessor ideal for fast computing | Renesas Electronics Corporation | 9,030 | |
| R8A774B0HA01BG#G0 | Processor 64-Bit ARM Cortex-A57 RISC 1.5GHz 1022-Pin FBGA | Renesas Electronics Corporation | 7,181 | |
| R8A774E0HA01BN#U0 | Processors - Application Specialized SOC RZ/G2H HDMI-OFF | Renesas Electronics | 3,973 |