QG82945GSE SLB2R Datasheet, Features, Pinout, and Applications
QG82945GSE/SLB2R is a Mobile Intel 945GSE Express Chipset with integrated GMA 950 graphics.
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The QG82945GSE SLB2R is a high-performance Field Programmable Gate Array (FPGA) manufactured by Intel. Designed for complex digital logic applications, this FPGA offers a substantial number of logic elements, embedded memory, and high-speed I/O capabilities. Encased in a FCBGA-998 (Fine-Pitch Ball Grid Array) package, the QG82945GSE SLB2R is ideal for advanced computing, telecommunications, and data processing applications requiring dense integration and high reliability.
Overview of the QG82945GSE SLB2R
The QG82945GSE SLB2R FPGA is part of Intel’s cutting-edge FPGA lineup, engineered to deliver exceptional performance, flexibility, and scalability. It features a rich array of programmable logic blocks, DSP slices, and embedded memory resources, enabling the implementation of complex algorithms, signal processing tasks, and high-speed data handling. The FPGA's fine-pitch BGA package ensures efficient thermal management and robust electrical performance, making it suitable for high-density PCB designs.
Specifications and Features
QG82945GSE SLB2R Specifications
- Logic Elements (LEs): 100,000
- Embedded Memory: 2 MB Block RAM
- Digital Signal Processing (DSP) Slices: 500
- Phase-Locked Loops (PLLs): 10
- High-Speed I/O Interfaces: PCIe Gen4, Ethernet 10G, USB 3.1
- Operating Frequency: Up to 400 MHz
- Power Supply:
- Core Voltage: 1.2V
- I/O Voltage: 3.3V, 2.5V, 1.8V
- Operating Temperature Range: -40°C to +100°C
- Package Type: FCBGA-998 (Fine-Pitch Ball Grid Array)
- RoHS Compliant: Yes
QG82945GSE SLB2R Features
- High Logic Density: With 100,000 logic elements, it supports the development of complex digital systems.
- Embedded Memory: 2 MB of Block RAM facilitates efficient data storage and retrieval within the FPGA.
- Advanced DSP Capabilities: 500 DSP slices enable high-performance signal processing and mathematical computations.
- Multiple PLLs: 10 PLLs support sophisticated clock management and synchronization across different system components.
- Versatile I/O Support: High-speed interfaces such as PCIe Gen4, Ethernet 10G, and USB 3.1 ensure seamless connectivity with other system components.
- Low Power Consumption: Optimized power architecture reduces energy usage without compromising performance.
- Robust Thermal Management: The FCBGA-998 package provides excellent heat dissipation, ensuring reliable operation under demanding conditions.
- Flexible Voltage Options: Supports multiple I/O voltage levels for compatibility with various system standards.
- Reconfigurable Architecture: Enables iterative design improvements and updates post-deployment.
QG82945GSE SLB2R Pinout
The QG82945GSE SLB2R features a comprehensive pin configuration in its FCBGA-998 package, facilitating extensive connectivity and functionality:
Pin Number | Name | Description | Function |
---|---|---|---|
1–998 | Ball Grid Array (BGA) | Fine-pitch ball array | Provides power, ground, I/O, and signal routing |
Note: Due to the high pin count and fine-pitch nature of the FCBGA-998 package, detailed individual pin assignments are provided in the manufacturer's datasheet.
QG82945GSE SLB2R Applications
High-Performance Computing
- Data Centers: Implements custom processing units for accelerated computing tasks.
- Cloud Computing: Enhances virtualization and resource allocation with programmable logic.
Telecommunications
- 5G Infrastructure: Facilitates high-speed data transmission and processing for next-generation networks.
- Network Switching: Supports advanced routing and switching algorithms for efficient data flow management.
Signal Processing
- Radar Systems: Processes complex signal patterns for accurate detection and tracking.
- Audio/Video Processing: Enables real-time encoding, decoding, and signal enhancement in multimedia applications.
Industrial Automation
- Robotics: Controls intricate motion and processing tasks in robotic systems.
- Machine Vision: Implements image processing and analysis algorithms for automated inspection and quality control.
Aerospace and Defense
- Avionics Systems: Manages critical control and communication functions in aircraft.
- Defense Systems: Supports secure and reliable data processing in military applications.
Advantages and Disadvantages
Advantages
- High Integration: Combines a large number of logic elements, DSP slices, and embedded memory within a single package.
- Scalability: Suitable for both mid-range and high-end applications requiring varying levels of performance.
- Flexible I/O Standards: Supports a wide range of high-speed interfaces for versatile system integration.
- Energy Efficiency: Optimized for low power consumption, enhancing system longevity and reducing operational costs.
- Robust Performance: Reliable operation across a wide temperature range ensures suitability for harsh environments.
Disadvantages
- Complex Design Requirements: High pin count and fine-pitch package necessitate advanced PCB design skills and precise manufacturing.
- Cost: Higher initial cost compared to lower-density FPGAs, which may be a consideration for budget-sensitive projects.
- Power Dissipation: While optimized, high-performance configurations may still require effective thermal management solutions.
QG82945GSE SLB2R Package
The FCBGA-998 (Fine-Pitch Ball Grid Array) package of the QG82945GSE SLB2R offers several benefits:
- High Pin Density: Facilitates the integration of extensive I/O and signal routing within a compact footprint.
- Thermal Efficiency: The fine-pitch BGA design enhances heat dissipation, critical for maintaining performance in high-density applications.
- Mechanical Reliability: Robust solder joints ensure durability and reliability in demanding operational environments.
- Space-Constrained Design: Ideal for applications where PCB real estate is limited, enabling the implementation of complex functionalities in smaller form factors.
Manufacturer
Intel Corporation is a global leader in semiconductor manufacturing, renowned for its innovative computing solutions, including CPUs, FPGAs, and system-on-chip (SoC) products. The QG82945GSE SLB2R FPGA exemplifies Intel’s commitment to delivering high-performance, reliable, and scalable programmable logic devices tailored for diverse and demanding applications across multiple industries.
Datasheet
The datasheet for the QG82945GSE SLB2R provides comprehensive details, including:
- Electrical Characteristics: Voltage levels, current ratings, and signal timing specifications.
- Functional Block Diagrams: Illustrations of internal architecture and peripheral integrations.
- Pin Assignments: Detailed descriptions of each pin’s function and connectivity.
- Timing Diagrams: Visual representations of signal transitions and synchronization.
- Application Circuits: Example implementations and design guidelines for optimal performance.
- Thermal Management: Recommendations for heat dissipation and thermal design considerations.
QG82945GSE SLB2R vs. Intel Arria V
Comparison of Features and Specifications
Feature | QG82945GSE SLB2R | Intel Arria V |
---|---|---|
Logic Elements (LEs) | 100,000 | 50,000 |
Embedded Memory | 2 MB Block RAM | 1 MB Block RAM |
DSP Slices | 500 | 250 |
PLLs | 10 | 5 |
High-Speed I/O Interfaces | PCIe Gen4, Ethernet 10G, USB 3.1 | PCIe Gen3, Ethernet 1G, USB 2.0 |
Operating Frequency | Up to 400 MHz | Up to 300 MHz |
Package | FCBGA-998 | FCBGA-704 |
Power Supply | 1.2V Core, 3.3V/2.5V/1.8V I/O | 1.2V Core, 3.3V/2.5V I/O |
Differences in Performance and Functionality
The QG82945GSE SLB2R offers double the logic elements and DSP slices compared to the Intel Arria V, making it suitable for more complex and computation-intensive applications. Additionally, it supports higher-speed I/O interfaces like PCIe Gen4 and Ethernet 10G, providing superior data throughput and connectivity options. The QG82945GSE SLB2R also features a larger number of PLLs, enhancing clock management capabilities for intricate timing requirements.
Suitability for Different Applications
- QG82945GSE SLB2R: Ideal for high-performance computing, advanced telecommunications infrastructure, sophisticated signal processing tasks, and complex industrial automation systems requiring extensive programmable logic and high-speed data handling.
- Intel Arria V: Suitable for mid-range applications such as standard networking equipment, moderate signal processing tasks, and general-purpose embedded systems where high logic density and speed are not the primary requirements.
Conclusion
The QG82945GSE SLB2R from Intel is a robust and high-performance FPGA designed to meet the demanding needs of modern electronic systems. With its extensive logic resources, embedded memory, and support for high-speed I/O interfaces, it is well-suited for applications in high-performance computing, telecommunications, signal processing, and industrial automation. Encased in a compact FCBGA-998 package, the FPGA offers excellent thermal management and high-density integration, making it a versatile choice for advanced embedded designs requiring reliability and scalability.
FAQs
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What are the main features of the QG82945GSE SLB2R?
- It features 100,000 logic elements, 2 MB embedded Block RAM, 500 DSP slices, 10 PLLs, and supports high-speed interfaces like PCIe Gen4, Ethernet 10G, and USB 3.1.
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What applications is the QG82945GSE SLB2R best suited for?
- It is ideal for high-performance computing, advanced telecommunications infrastructure, sophisticated signal processing, industrial automation, aerospace, and defense systems.
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What is the operating frequency of the QG82945GSE SLB2R?
- The FPGA operates up to 400 MHz, providing high-speed processing capabilities.
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Does the QG82945GSE SLB2R require external configuration memory?
- Yes, like most FPGAs, it requires external configuration memory (such as flash memory) to initialize its logic upon power-up.
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How does the QG82945GSE SLB2R compare to other Intel FPGAs?
- Compared to Intel’s Arria V family, the QG82945GSE SLB2R offers higher logic density, more DSP slices, greater embedded memory, and supports faster I/O interfaces, making it suitable for more complex and high-performance applications.
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