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XCZU6CG-2FFVB1156E

SoC FPGA XCZU6CG-2FFVB1156E

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Overview of XCZU6CG-2FFVB1156E

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 469K+ Logic Cells 533MHz, 1.3GHz 1156-FCBGA (35x35)

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Series XCZU6CG Product Status Active
Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ)
Package / Case FCBGA-1156 Supplier Device Package 1156-FCBGA (35x35)
Number of I/O 328 Base Product Number XCZU6
Manufacturer Xilinx Product Category SoC FPGA
Shipping Restrictions This product may require additional documentation to export from the United States. RoHS Details
Mounting Style SMD/SMT Core ARM Cortex A53, ARM Cortex R5
Number of Cores 4 Core Maximum Clock Frequency 600 MHz, 1.5 GHz
L1 Cache Instruction Memory 2 x 32 kB, 2 x 32 kB L1 Cache Data Memory 2 x 32 kB, 2 x 32 kB
Number of Logic Elements 469446 LE Adaptive Logic Modules - ALMs 26825.5 ALM
Embedded Memory 25.1 Mbit Number of I/Os 352 I/O
Operating Supply Voltage 850 mV Minimum Operating Temperature 0 C
Maximum Operating Temperature + 100 C Brand Xilinx
Distributed RAM 6.9 Mbit Embedded Block RAM - EBR 25.1 Mbit
Moisture Sensitive Yes Number of Logic Array Blocks - LABs 26825.5 LAB
Number of Transceivers 24 Transceiver Product Type SoC FPGA
Subcategory SOC - Systems on a Chip Tradename Zynq UltraScale+

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