• XC6SLX25-2FTG256I FBGA-256
XC6SLX25-2FTG256I FBGA-256

XC6SLX25-2FTG256I

XC6SLX25-2FTG256I: FPGA featuring 1879 CLBS running at 667MHz built with PBGA256 technology

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  • Part Number : XC6SLX25-2FTG256I

  • Package/Case : FBGA-256

  • Brands : Amd

  • Components Categories : FPGAs (Field Programmable Gate Array)

  • Datesheet : XC6SLX25-2FTG256I DataSheet (PDF)

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Overview of XC6SLX25-2FTG256I

The XC6SLX25-2FTG256I is a high-performance field-programmable gate array (FPGA) featuring a capacity of 25,000 logic cells and a 256-pin FTG256 package. This FPGA offers reconfigurable logic capabilities, making it ideal for a wide range of applications requiring custom digital circuit implementations.

Pinout

(Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.)

  • VCCAUX: Auxiliary Analog Supply Voltage
  • VCCINT: Internal Digital Core Voltage
  • GND: Ground Connection
  • IOB_33: I/O Bank 33
  • IOB_65: I/O Bank 65
  • CFG: Configuration Pins
  • CLK: Clock Input Pins
  • GB: Global Buffers
  • VS: System Monitor Voltage Sense
  • VP: Programming Supply Voltage
  • HR: High Range Power Connection
  • NC: No Connection
  • NC: No Connection
  • NC: No Connection
  • NC: No Connection

Circuit Diagram

Include a circuit diagram illustrating the connections and operation of the XC6SLX25-2FTG256I FPGA for a visual representation.

Key Features

  • 25,000 Logic Cells: The XC6SLX25-2FTG256I offers a capacity of 25,000 logic cells for implementing custom digital circuits.
  • High-Performance FPGA: This FPGA provides high-speed processing and reconfigurable logic capabilities for versatile applications.
  • 256-Pin FTG256 Package: Housed in a 256-pin FTG256 package, the XC6SLX25-2FTG256I offers ample I/O connectivity and flexibility.
  • Low Power Consumption: With efficient power management features, this FPGA consumes minimal power during operation.
  • Analog and Digital Support: The XC6SLX25-2FTG256I supports both analog and digital functions, catering to diverse design requirements.

Note: For detailed technical specifications, please refer to the XC6SLX25-2FTG256I datasheet.

Application

  • Digital Signal Processing: Ideal for applications requiring real-time signal processing and complex algorithms.
  • Communications Systems: Suitable for use in communications systems for signal modulation and demodulation.
  • Embedded Systems: Used in embedded systems for custom logic implementations and system control.

Functionality

The XC6SLX25-2FTG256I FPGA offers reconfigurable logic capabilities, allowing users to implement custom digital circuits tailored to their specific application needs. It provides high performance and flexibility in a compact package.

Usage Guide

  • Power Supply: Connect VCCAUX and VCCINT to their respective supply voltages for proper operation.
  • IO Connections: Connect the I/O pins to external devices as per the design requirements.
  • Configuration: Use the CFG pins for configuring the FPGA during startup.

Frequently Asked Questions

Q: Can the XC6SLX25-2FTG256I be reprogrammed multiple times?
A: Yes, the XC6SLX25-2FTG256I supports multiple reprogramming cycles, allowing for flexibility in design iterations.

Equivalent

For similar functionalities, consider these alternatives to the XC6SLX25-2FTG256I:

  • XC7A25T-2FG256I: This FPGA offers enhanced performance and capacity compared to the XC6SLX25-2FTG256I for larger-scale applications.
  • XC6VLX25-2FFG256I: A compatible FPGA model with additional features and optimized for specific design requirements.

XC6SLX25-2FTG256I

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Product Category FPGA - Field Programmable Gate Array RoHS Details
Series XC6SLX25 Number of Logic Elements 24051 LE
Adaptive Logic Modules - ALMs 3758 ALM Embedded Memory 936 kbit
Number of I/Os 186 I/O Supply Voltage - Min 1.14 V
Supply Voltage - Max 1.26 V Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 100 C Mounting Style SMD/SMT
Package / Case FBGA-256 Brand AMD / Xilinx
Distributed RAM 229 kbit Embedded Block RAM - EBR 936 kbit
Maximum Operating Frequency 1.08 GHz Moisture Sensitive Yes
Number of Logic Array Blocks - LABs 1879 LAB Operating Supply Voltage 1.2 V
Product Type FPGA - Field Programmable Gate Array Factory Pack Quantity 1
Subcategory Programmable Logic ICs Tradename Spartan
Unit Weight 0.515063 oz

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