• XC3S2000-4FGG676C FBGA-676
XC3S2000-4FGG676C FBGA-676

XC3S2000-4FGG676C

XC3S2000-4FGG676C - Advanced Programmable Logic Device with 676 Ball Grid Array Package

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  • Part Number : XC3S2000-4FGG676C

  • Package/Case : FBGA-676

  • Brands : Amd

  • Components Categories : FPGAs (Field Programmable Gate Array)

  • Datesheet : XC3S2000-4FGG676C DataSheet (PDF)

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Overview of XC3S2000-4FGG676C

XC3S2000-4FGG676C is a Field-Programmable Gate Array (FPGA) manufactured by Xilinx. It has a density of up to 2 million system gates, making it suitable for high-performance applications. The device operates at a speed grade of -4, indicating a maximum operating frequency of 450MHz.The FPGA comes in a 676-pin Fine-pitch Ball Grid Array (FBGA) package, providing a compact form factor for easy integration into designs. It features 405 user I/Os, enabling connectivity with external devices and components.The XC3S2000-4FGG676C supports a variety of advanced features, including embedded RAM blocks, DSP slices, and configurable logic blocks. These capabilities make it versatile and customizable for a wide range of applications, from telecommunications to industrial automation.

XC3S2000-4FGG676C

Key Features

  • XC3S2000-4FGG676C is a Spartan-3 FPGA from Xilinx
  • It has 2,000,000 system gates
  • Operates at a high frequency of 400 MHz
  • Offers 676-pin FBGA package
  • Includes 256 I/Os for connectivity
  • Features 4 CLBs and 72 Kbits of Block RAM

Application

  • Industrial automation
  • Communications
  • High-performance computing
  • Defense and aerospace
  • Medical imaging
  • Consumer electronics
  • Automotive
  • Embedded systems
  • Networking
  • Video processing

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Product Category FPGA - Field Programmable Gate Array RoHS Details
Series XC3S2000 Number of Logic Elements 46080 LE
Number of I/Os 489 I/O Supply Voltage - Min 1.2 V
Supply Voltage - Max 1.2 V Minimum Operating Temperature 0 C
Maximum Operating Temperature + 85 C Mounting Style SMD/SMT
Package / Case FBGA-676 Brand AMD / Xilinx
Distributed RAM 320 kbit Embedded Block RAM - EBR 720 kbit
Maximum Operating Frequency 280 MHz Moisture Sensitive Yes
Number of Gates 2000000 Operating Supply Voltage 1.2 V
Product Type FPGA - Field Programmable Gate Array Factory Pack Quantity 1
Subcategory Programmable Logic ICs Tradename Spartan
Unit Weight 0.647256 oz

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