W63CH6MBVACE

Name: W63CH6MBVACE
Brand: Winbond Electronics
Rating: 4.5 (10 reviews)

DRAM Chip Mobile LPDDR3 SDRAM 4Gbit 256Mx16 1.2V/1.8V 178-Pin VFBGA

Inventory:6,128

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The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

ECCN (US)	EAR99	Part Status	Obsolete
HTS	8542.32.00.36	DRAM Type	Mobile LPDDR3 SDRAM
Chip Density (bit)	4G	Organization	256Mx16
Number of Internal Banks	8	Number of Words per Bank	32M
Number of Bits/Word (bit)	16	Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	933	Maximum Access Time (ns)	5.5
Address Bus Width (bit)	17	Interface Type	HSUL_12
Minimum Operating Supply Voltage (V)	1.14\|1.7	Maximum Operating Supply Voltage (V)	1.3\|1.95
Operating Current (mA)	260	Minimum Operating Temperature (°C)	-25
Maximum Operating Temperature (°C)	85	Number of I/O Lines (bit)	16
Mounting	Surface Mount	Package Height	0.67
Package Width	11	Package Length	11.5
PCB changed	178	Standard Package Name	BGA
Supplier Package	VFBGA	Pin Count	178

Warranty, Returns, and Additional Information

QA & Return Policy

Parts Quality Guarantee: 365 days

Returns for refund: within 90 days

Returns for Exchange: within 90 days
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Parts Packaging Guarantee: Featuring 100% ESD anti-static protection, our packaging incorporates high toughness and superior buffering capabilities.
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