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W29N02GZBIBA

2G bit 1.8V NAND Flash Memory

Inventory:8,455

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  • 365 Days Quality Guarantee
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Quick Inquiry

Please submit RFQ for W29N02GZBIBA or email to us: Email: [email protected], we will contact you in 12 hours.

Overview of W29N02GZBIBA

FLASH - NAND (SLC) Memory IC 2Gbit Parallel 35 ns 63-VFBGA (9x11)

Key Features

  • · Single 5-volt write (erase and program) operations
  • · Fast page-write operations
  • - 256 bytes per page
  • - Page write (erase/program) cycle: 5 mS (typ.)
  • - Effective byte-write (erase/program) cycle time: 19.5 mS
  • - Optional software-protected data write
  • · Fast chip-erase operation: 50 mS
  • · Two 16 KB boot blocks with lockout
  • · Page write (erase/program) cycles: 50K (typ.)
  • · Read access time: 70/90/120 nS
  • · Ten-year data retention
  • · Software and hardware data protection
  • · Low power consumption
  • - Active current: 25 mA (typ.)
  • - Standby current: 20 mA (typ.)
  • ·Automaticwrite (erase/program) timing with internal VPP generation
  • · End of write (erase/program) detection
  • - Toggle bit
  • - Data polling
  • · Latched address and data
  • · All inputs and outputs directly TTL compatible
  • · JEDEC standard byte-wide pinouts
  • · Available packages: 32-pin 600 mil DIP, TSOP and PLCC

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Pbfree Code Yes Rohs Code Yes
Part Life Cycle Code Active Ihs Manufacturer WINBOND ELECTRONICS CORP
Package Description VFBGA, Reach Compliance Code compliant
ECCN Code EAR99 HTS Code 8542.32.00.51
Samacsys Manufacturer Winbond JESD-30 Code R-PBGA-B63
Length 11 mm Memory Density 2147483648 bit
Memory IC Type FLASH Memory Width 8
Number of Functions 1 Number of Terminals 63
Number of Words 268435456 words Number of Words Code 256000000
Operating Mode ASYNCHRONOUS Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C Organization 256MX8
Package Body Material PLASTIC/EPOXY Package Code VFBGA
Package Shape RECTANGULAR Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 1.8 V Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 1.95 V Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V Surface Mount YES
Technology CMOS Temperature Grade INDUSTRIAL
Terminal Form BALL Terminal Pitch 0.8 mm
Terminal Position BOTTOM Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type SLC NAND TYPE Width 9 mm

Warranty & Returns

Warranty, Returns, and Additional Information

  • QA & Return Policy

    Parts Quality Guarantee: 365 days

    Returns for refund: within 90 days

    Returns for Exchange: within 90 days

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    Parts Packaging Guarantee: Featuring 100% ESD anti-static protection, our packaging incorporates high toughness and superior buffering capabilities.

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