W25Q16DVSNIG

FLASH - NOR Memory IC 16Mbit SPI - Quad I/O 104 MHz 8-SOIC

Key Features

• Family of SpiFlash Memories
• – W25Q16DV: 16M-bit / 2M-byte (2,097,152)
• – 256-byte per programmable page
• – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
• – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
• – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
• Highest Performance Serial Flash
• – 104MHz Dual SPI / Quad SPI clocks
• – 208/416MHz equivalent Dual/Quad SPI
• – 52MB/S continuous data transfer rate
• – Up to 8X that of ordinary Serial Flash
• – More than 100,000 erase/program cycles
• – More than 20-year data retention
• Efficient “Continuous Read Mode”
• – Low Instruction overhead
• – Continuous Read with 8/16/32/64-Byte Wrap
• – As few as 8 clocks to address memory
• – Allows true XIP (execute in place) operation
• – Outperforms X16 Parallel Flash
• Low Power, Wide Temperature Range
• – Single 2.7 to 3.6V supply
• – 4mA active current, <1µA Power-down (typ.)
• – -40°C to +85°C operating range
• Flexible Architecture with 4KB sectors
• – Uniform Sector/Block Erase (4/32/64K-bytes)
• – Program one to 256 bytes
• – Erase/Program Suspend & Resume
• Advanced Security & Identification Features
• – Software and Hardware Write-Protect
• – Top/Bottom, 4KB complement array protection
• – Power Supply Lock-Down and OTP protection
• – 64-Bit Unique ID for each device
• – Discoverable Parameters (SFDP) Register
• – 3X256-Byte Security Registers with OTP locks
• – Volatile & Non-volatile Status Register Bits
• Space Efficient Packaging(1)
• – 8-pin SOIC 150/208-mil
• – 8-pad WSON 6x5-mm
• – 8-pad USON 4X3mm / 4X4mm
• – 8-pin PDIP 300-mil
• – 16-pin SOIC 300-mil
• – 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)
• – Contact Winbond for KGD and other options