TMS320C6747BZKBA3
Fixed/Floating-point Digital Signal Processor
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Part Number : TMS320C6747BZKBA3
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Package/Case : BGA-256
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Brands : TI
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Components Categories : DSP
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Datesheet : TMS320C6747BZKBA3 DataSheet (PDF)
The TMS320C6747BZKBA3 is a high-performance digital signal processor (DSP) from Texas Instruments, offering advanced processing capabilities for a wide range of applications. This DSP features a dual-core architecture with integrated peripherals, making it suitable for demanding signal processing tasks. (Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.) Include a circuit diagram illustrating the connections and operation of the TMS320C6747BZKBA3 DSP for a visual representation. Note: For detailed technical specifications, please refer to the TMS320C6747BZKBA3 datasheet. Functionality The TMS320C6747BZKBA3 is a powerful DSP designed to handle complex signal processing tasks with efficiency and precision. Its dual-core architecture and integrated peripherals make it a versatile solution for various applications. Usage Guide Q: Can the TMS320C6747BZKBA3 be used in real-time signal processing applications? For similar functionalities, consider these alternatives to the TMS320C6747BZKBA3:Overview of TMS320C6747BZKBA3
Pinout
Circuit Diagram
Key Features
Application
Frequently Asked Questions
A: Yes, the TMS320C6747BZKBA3 is designed for real-time signal processing tasks requiring high computational power and efficiency.Equivalent
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Source Content uid | TMS320C6747BZKBA3 | Pbfree Code | No |
Rohs Code | Yes | Part Life Cycle Code | Obsolete |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | Part Package Code | BGA |
Package Description | BGA, BGA256,16X16,40 | Pin Count | 256 |
Reach Compliance Code | compliant | ECCN Code | 3A991.A.2 |
HTS Code | 8542.31.00.01 | Samacsys Manufacturer | Texas Instruments |
Address Bus Width | 16 | Barrel Shifter | NO |
Bit Size | 32 | Boundary Scan | YES |
Clock Frequency-Max | 30 MHz | External Data Bus Width | 16 |
Format | FLOATING POINT | Internal Bus Architecture | MULTIPLE |
JESD-30 Code | S-PBGA-B256 | JESD-609 Code | e1 |
Length | 17 mm | Low Power Mode | YES |
Moisture Sensitivity Level | 3 | Number of Terminals | 256 |
Operating Temperature-Max | 105 °C | Operating Temperature-Min | -40 °C |
Package Body Material | PLASTIC/EPOXY | Package Code | BGA |
Package Equivalence Code | BGA256,16X16,40 | Package Shape | SQUARE |
Package Style | GRID ARRAY | Peak Reflow Temperature (Cel) | 260 |
Power Supplies | 1.2,1.8,3.3 V | Qualification Status | Not Qualified |
RAM (words) | 8192 | Seated Height-Max | 2.05 mm |
Supply Voltage-Max | 1.32 V | Supply Voltage-Min | 1.14 V |
Supply Voltage-Nom | 1.2 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN SILVER COPPER | Terminal Form | BALL |
Terminal Pitch | 1 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 | Width | 17 mm |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |
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