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TMS320C6747BZKBA3

Fixed/Floating-point Digital Signal Processor

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Overview of TMS320C6747BZKBA3

The TMS320C6747BZKBA3 is a high-performance digital signal processor (DSP) from Texas Instruments, offering advanced processing capabilities for a wide range of applications. This DSP features a dual-core architecture with integrated peripherals, making it suitable for demanding signal processing tasks.

Pinout

(Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.)

  • RESET: Reset pin
  • CLKOUT: Clock output
  • VDD_CORE: Core voltage supply
  • VDD2P5: 2.5V supply
  • DVDD2P5: Digital 2.5V supply
  • VDD1P8: 1.8V supply
  • DVDD1P8: Digital 1.8V supply
  • TEST: Test mode pin
  • GND: Ground
  • CLKIN: Clock input
  • VDD_MGTAVCC: Multi-gigabit transceiver analog supply
  • VDD_MGTAVTT: Multi-gigabit transceiver termination supply
  • GND_MGTAVTT: Multi-gigabit transceiver termination ground
  • USB0_DP: USB 0 positive data line
  • USB0_DM: USB 0 negative data line

Circuit Diagram

Include a circuit diagram illustrating the connections and operation of the TMS320C6747BZKBA3 DSP for a visual representation.

Key Features

  • Dual-Core Architecture: The TMS320C6747BZKBA3 features two processing cores for enhanced performance and parallel processing capabilities.
  • Integrated Peripherals: This DSP includes integrated peripherals such as USB interfaces, multi-gigabit transceivers, and various communication ports for flexible connectivity.
  • High Performance: With its advanced architecture and high clock speeds, this DSP offers high computational power for demanding applications.
  • Wide Operating Voltage Range: Operates from a varied voltage range, providing flexibility in system design.
  • On-Chip Memory: Includes on-chip memory for efficient data storage and processing.

Note: For detailed technical specifications, please refer to the TMS320C6747BZKBA3 datasheet.

Application

  • Audio Processing: Ideal for audio signal processing applications, such as in audio codecs and digital audio workstations.
  • Wireless Communication: Suitable for wireless communication systems requiring high-speed signal processing and data handling.
  • Industrial Automation: Used in industrial automation systems for control, monitoring, and signal processing tasks.

Functionality

The TMS320C6747BZKBA3 is a powerful DSP designed to handle complex signal processing tasks with efficiency and precision. Its dual-core architecture and integrated peripherals make it a versatile solution for various applications.

Usage Guide

  • Power Supply: Connect the core voltage supply (VDD_CORE) and other necessary power supplies as per the datasheet recommendations.
  • Clock Input: Provide a stable clock input signal to the CLKIN pin for proper operation.
  • Peripheral Connections: Interface external devices with the integrated peripherals as required for the application.

Frequently Asked Questions

Q: Can the TMS320C6747BZKBA3 be used in real-time signal processing applications?
A: Yes, the TMS320C6747BZKBA3 is designed for real-time signal processing tasks requiring high computational power and efficiency.

Equivalent

For similar functionalities, consider these alternatives to the TMS320C6747BZKBA3:

  • TMS320C6745BZKB3: A lower-cost variant with similar processing capabilities and peripherals.
  • ADSP-21489: A DSP from Analog Devices offering comparable performance and features to the TMS320C6747BZKBA3.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Source Content uid TMS320C6747BZKBA3 Pbfree Code No
Rohs Code Yes Part Life Cycle Code Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC Part Package Code BGA
Package Description BGA, BGA256,16X16,40 Pin Count 256
Reach Compliance Code compliant ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 Samacsys Manufacturer Texas Instruments
Address Bus Width 16 Barrel Shifter NO
Bit Size 32 Boundary Scan YES
Clock Frequency-Max 30 MHz External Data Bus Width 16
Format FLOATING POINT Internal Bus Architecture MULTIPLE
JESD-30 Code S-PBGA-B256 JESD-609 Code e1
Length 17 mm Low Power Mode YES
Moisture Sensitivity Level 3 Number of Terminals 256
Operating Temperature-Max 105 °C Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY Package Code BGA
Package Equivalence Code BGA256,16X16,40 Package Shape SQUARE
Package Style GRID ARRAY Peak Reflow Temperature (Cel) 260
Power Supplies 1.2,1.8,3.3 V Qualification Status Not Qualified
RAM (words) 8192 Seated Height-Max 2.05 mm
Supply Voltage-Max 1.32 V Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V Surface Mount YES
Technology CMOS Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER Terminal Form BALL
Terminal Pitch 1 mm Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 Width 17 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER

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