KLM8G1GETF-B041003
MLC NAND Flash Serial e-MMC 1.8V/3.3V 64G-bit 64G x 1 153-Pin FBGA
Inventory:6,902
- 90-day after-sales guarantee
- 365 Days Quality Guarantee
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- 7*24 hours service quarantee
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Part Number : KLM8G1GETF-B041003
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Package/Case : FBGA
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Brands : Samsung Electronics
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Components Categories : Flash
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Datesheet : KLM8G1GETF-B041003 DataSheet (PDF)
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
| ECCN (US) | 3A991b.1.a. | Part Status | Active |
| HTS | 8542.39.0001 | Automotive | No |
| PPAP | No | Cell Type | MLC NAND |
| Chip Density (bit) | 64G | Architecture | Sectored |
| Boot Block | Yes | Number of Bits/Word (bit) | 1/4/8 |
| Number of Words | 64G/16G/8G | Programmability | Yes |
| Timing Type | Synchronous | Maximum Erase Time (s) | 0.02 |
| Interface Type | Serial e-MMC | Maximum Operating Frequency (MHz) | 200 |
| Minimum Operating Supply Voltage (V) | 2.7 | Typical Operating Supply Voltage (V) | 3|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 | Operating Current (mA) | 50 |
| Minimum Operating Temperature (°C) | -25 | Maximum Operating Temperature (°C) | 85 |
| Command Compatible | Yes | ECC Support | Yes |
| Support of Page Mode | No | Mounting | Surface Mount |
| Package Height | 0.49 | Package Width | 11.5 |
| Package Length | 13 | PCB changed | 153 |
| Standard Package Name | BGA | Supplier Package | FBGA |
| Pin Count | 153 | Lead Shape | Ball |
Warranty & Returns
Warranty, Returns, and Additional Information
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QA & Return Policy
Parts Quality Guarantee: 365 days
Returns for refund: within 90 days
Returns for Exchange: within 90 days
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Shipping and Package
Shipping:For example, FedEx, SF, UPS, or DHL.UPS, or DHL.
Parts Packaging Guarantee: Featuring 100% ESD anti-static protection, our packaging incorporates high toughness and superior buffering capabilities.
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Payment
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If you have specific payment channel preferences or requirements, please get in touch with our sales team for assistance.
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