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EP2C35F672I8

FPGA Cyclone® II Family 33216 Cells 402.58MHz 90nm Technology 1.2V 672-Pin FBGA

Quantity Unit Price(USD) Ext. Price
1 $269.932 $269.93
200 $104.462 $20,892.40
500 $100.790 $50,395.00
1000 $98.976 $98,976.00

Inventory:7,887

*The price is for reference only.
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Overview of EP2C35F672I8

Intel's EP2C35F672I8 FPGA is a standout performer in the field of programmable gate arrays, offering a comprehensive set of features that cater to the needs of high-performance applications. With 35,376 logic elements, 1,152 kilobits of embedded memory, and 288 embedded multipliers, this FPGA provides the necessary resources to handle complex tasks with ease. Its 315 megahertz maximum operating frequency and 672 user I/O pins make it a versatile choice for telecommunications, industrial automation, and automotive systems. Additionally, the ability to be programmed using industry-standard design tools like Quartus II software allows for custom logic functions and algorithms to be seamlessly implemented

Key Features

  • High-density architecture with 4,608 to 68,416 LEs
  • M4K embedded memory blocks
  • Up to 1.1 Mbits of RAM available without reducing available logic
  • 4,096 memory bits per block (4,608 bits per block including 512 parity bits)
  • Variable port configurations of ×1, ×2, ×4, ×8, ×9, ×16, ×18, ×32, and ×36
  • True dual-port (one read and one write, two reads, or two writes) operation for ×1, ×2, ×4, ×8, ×9, ×16, and ×18 modes
  • Byte enables for data input masking during writes
  • Up to 260-MHz operation
  • Embedded multipliers
  • Up to 150 18- × 18-bit multipliers are each configurable as two independent 9- × 9-bit multipliers with up to 250-MHz performance
  • Optional input and output registers
  • Advanced I/O support
  • High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL, differential HSTL, and differential SSTL
  • Single-ended I/O standard support, including 2.5-V and 1.8-V, SSTL class I and II, 1.8-V and 1.5-V HSTL class I and II, 3.3-V PCI and PCI-X 1.0, 3.3-, 2.5-, 1.8-, and 1.5-V LVCMOS, and 3.3-, 2.5-, and 1.8-V LVTTL
  • Peripheral Component Interconnect Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 3.0 compliance for 3.3-V operation at 33 or 66 MHz for 32- or 64-bit interfaces
  • PCI Express with an external TI PHY and an Altera PCI Express ×1 Megacore® function
  • 133-MHz PCI-X 1.0 specification compatibility
  • High-speed external memory support, including DDR, DDR2, and SDR SDRAM, and QDRII SRAM supported by drop in Altera IP MegaCore functions for ease of use
  • Three dedicated registers per I/O element (IOE): one input register, one output register, and one output-enable register
  • Programmable bus-hold feature
  • Programmable output drive strength feature
  • Programmable delays from the pin to the IOE or logic array
  • I/O bank grouping for unique VCCIO and/or VREF bank settings
  • MultiVolt™ I/O standard support for 1.5-, 1.8-, 2.5-, and 3.3-interfaces
  • Hot-socketing operation support
  • Tri-state with weak pull-up on I/O pins before and during configuration
  • Programmable open-drain outputs
  • Series on-chip termination support
  • (Continue ...)

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Series Cyclone® II Package Tray
Product Status Active Programmabe Not Verified
Number of LABs/CLBs 2076 Number of Logic Elements/Cells 33216
Total RAM Bits 483840 Number of I/O 475
Voltage - Supply 1.15V ~ 1.25V Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) Package / Case 672-BGA
Supplier Device Package 672-FBGA (27x27) Base Product Number EP2C35

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