CC2560ARVMT

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. With Bluetooth 4.1 compliance and best-in-class RF performance, this device, in conjunction with a microcontroller unit (MCU), offers significant power savings and a range of about 2X compared to other Bluetooth LE-only solutions. The TI Dual-Mode Bluetooth Stack software, certified and provided royalty-free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs, adds even more value to this solution. Supporting a variety of profiles, including SPP, A2DP, AVRCP, HFP, HID, GATT, and Bluetooth LE profiles and services, this solution caters to diverse application needs. Moreover, multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design, make it an attractive option for creating low-end, low-power audio solutions

Key Features

• TI’s Single-Chip Bluetooth Solution With Bluetooth
  Basic Rate (BR), Enhanced Data Rate (EDR), and
  Low Energy (LE) Support; Available in Two
  Variants:
  • Dual-Mode Bluetooth CC2564 Controller
  • Bluetooth CC2560 Controller
• CC2564 Bluetooth 4.1 Controller Subsystem
  Qualified (QDID 58852); Compliant up to the HCI
  Layer
• Highly Optimized for Low-Cost Designs:
  • Single-Ended 50-Ω RF Interface
  • Package Footprint: 76 Terminals, 0.6-mm Pitch,
    8-mm x 8-mm mrQFN
• BR/EDR Features Include:
  • Up to 7 Active Devices
  • Scatternet: Up to 3 Piconets Simultaneously, 1
    as Master and 2 as Slaves
  • Up to 2 SCO Links on the Same Piconet
  • Support for All Voice Air-Coding – Continuously
    Variable Slope Delta (CVSD), A-Law, µ-Law,
    and Transparent (Uncoded)
  • CC2560B/CC2564B Devices Provide an
    Assisted Mode for HFP 1.6 Wideband Speech
    (WBS) Profile or A2DP Profile to Reduce Host
    Processing and Power
  • Support of Multiple Bluetooth Profiles With
    Enhanced QoS
• LE Features Include:
  • Support of Up to 10 (CC2564B) Connections
  • Multiple Sniff Instances Tightly Coupled to
    Achieve Minimum Power Consumption
  • Independent Buffering for LE Allows Large
    Numbers of Multiple Connections Without
    Affecting BR/EDR Performance.
  • Built-In Coexistence and Prioritization Handling
    for BR/EDR and LE
• Best-in-Class Bluetooth (RF) Performance
  (TX Power, RX Sensitivity, Blocking)
  • Class 1 TX Power Up to +10 dBm
  • –95 dbm Typical RX Sensitivity
  • Internal Temperature Detection and
    Compensation to Ensure Minimal Variation in
    RF Performance Over Temperature, No
    External Calibration Required
  • Improved Adaptive Frequency Hopping (AFH)
    Algorithm With Minimum Adaptation Time
  • Provides Longer Range, Including 2x Range
    Over Other LE-Only Solutions
• Advanced Power Management for Extended
  Battery Life and Ease of Design
  • On-Chip Power Management, Including Direct
    Connection to Battery
  • Low Power Consumption for Active, Standby,
    and Scan Bluetooth Modes
  • Shutdown and Sleep Modes to Minimize Power
    Consumption
• Physical Interfaces:
  • UART Interface With Support for Maximum
    Bluetooth Data Rates
    • UART Transport Layer (H4) With Maximum
      Rate of 4 Mbps
    • Three-Wire UART Transport Layer (H5) With
      Maximum Rate of 4 Mbps (CC2560B and
      CC2564B Only)
  • Fully Programmable Digital PCM-I2S Codec
    Interface
• Flexibility for Easy Stack Integration and Validation
  Into Various Microcontrollers, Such as MSP430™
  and ARM® Cortex®-M3 and Cortex®-M4 MCUs
• CC256x Bluetooth Hardware Evaluation Tool: PC-
  Based Application to Evaluate RF Performance of
  the Device and Configure Service Pack
• Device Pin-to-Pin Compatible With Previous
  Devices or Modules