CC2340R52E0RKPR

The SimpleLink™ CC2340R5 device is a 2.4 GHz wireless microcontroller (MCU) targeting Bluetooth® 5.3 Low Energy and Proprietary 2.4 GHz applications. The device is optimized for low-power wireless communication with on-chip dual image Over the Air Download (OAD) support ⁽¹⁾ in Building automation (wireless sensors, lighting control, beacons), asset tracking, medical, retail EPOS (electronic point of sale), ESL (electronic shelf label), and Personal electronics (toys, HID, stylus pens) markets. highlighted features of this device include:

• Support for Bluetooth ® 5 features: High Speed Mode (2 Mbps PHY), Long Range (LE Coded 125 kbps and 500 kbps PHYs), Privacy 1.2.1 and Channel Selection Algorithm #2, as well as backwards compatibility and support for key features from the Bluetooth ® 4.2 and earlier Low Energy specifications.
• Fully-qualified Bluetooth ® 5.3 software protocol stack included with the SimpleLink™ CC23xx Software Development Kit (SDK).
• Zigbee® protocol stack support in the SimpleLink™ CC23xx Software Development Kit (SDK) 2
• Ultra-low standby current less than 0.71 µA with RTC operational and full RAM retention that enables significant battery life extension especially for applications with longer sleep intervals.
• Integrated balun for reduced Bill-of-Material (BOM) board layout
• Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth ® Low Energy (-102 dBm for 125 kbps LE Coded PHY, with integrated balun).

The CC2340R5 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

⁽¹⁾Available in a future SDK

Key Features

Wireless microcontroller

• Optimized 48-MHz Arm Cortex-M0+ processor
• 512 KB of in-system programmable flash
• 12 KB of ROM for bootloader and drivers
• 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mode
• 2.4 GHz RF transceiver compatible with Bluetooth 5.3 Low Energy
• Integrated balun
• Supports over-the-air upgrade (OTA)
• Serial Wire Debug (SWD)

Low power consumption

• MCU consumption:
  • 2.6 mA active mode, CoreMark
  • 53 µA/MHz running CoreMark
  • < 710 nA standby mode, RTC, 36 KB RAM
  • 150 nA shutdown mode, wake-up on pin
• Radio Consumption:
  • 5.3 mA RX
  • 5.1 mA TX at 0 dBm
  • < 11.0 mA TX at +8 dBm

Wireless protocol support

• Bluetooth® 5.3 Low Energy
• Zigbee® ⁽¹⁾
• SimpleLink™ TI 15.4-stack 1
• Proprietary systems

High-performance radio

• -102 dBm for Bluetooth® Low Energy 125 kbps
• -96.5 dBm for Bluetooth® Low Energy 1 Mbps
• Output power up to +8 dBm with temperature compensation

Regulatory compliance

• Suitable for systems targeting compliance with these standards:
  • EN 300 328 (Europe)
  • FCC CFR47 Part 15
  • ARIB STD-T66 (Japan)

MCU peripherals

• Up to 26 I/O Pads
  • 2 IO pads SWD, muxed with GPIOs
  • 2 IO pads LFXT, muxed with GPIOs
  • Up to 22 DIOs (analog or digital IOs)
• 3× 16-bit and 1× 24-bit general-purpose timers, quadrature decode mode support
• 12-bit ADC, 1.2 Msps with external reference, 267 ksps with internal reference, up to 12 external ADC inputs
• 1× low power comparator
• 1× UART
• 1× SPI
• 1× I 2C
• Real-time clock (RTC)
• Integrated temperature and battery monitor
• Watchdog timer

Security enablers

• AES 128-bit cryptographic accelerator
• Random number generator from on-chip analog noise

Development tools and software

• LP-EM-CC2340R5 LaunchPad Development Kit
• SimpleLink™ CC23xx Software Development Kit (SDK)
• SmartRF™ Studio for simple radio configuration
• SysConfig system configuration tool

Operating range

• On-chip buck DC/DC converter
• 1.71-V to 3.8-V single supply voltage
• T j: -40 to +125°C

RoHS-compliant package

• 5-mm × 5-mm RKP QFN40 (26 GPIOs)
• 4-mm × 4-mm RGE QFN24 (12 GPIOs)

⁽¹⁾Available in a future SDK